APPA BOND 7TH GEN

800

Appa bond is is a single-component, dual curing adhesive for direct and indirect bonding procedures that features compatibility with all etching techniques:  self-etch, selective-enamel-etch and total-etch.

KEY SPECIFICATION

  • UNIVERSAL APPLICATION – For direct and indirect bonding procedures and compatibility with all etching techniques
  • PREDICTABLE RESULTS – High bond strength on wet or over-dried dentin

Notice: Undefined index: enabledOffers in /home/u975537268/domains/sdsendo.com/public_html/wp-content/plugins/cashfree/cashfree.php on line 79
Category:

Reviews

There are no reviews yet.

Be the first to review “APPA BOND 7TH GEN”

Your email address will not be published. Required fields are marked *